Looking deeper into quality: new X-ray setup reinforces our quality control
To further optimize the quality of our electronics and PCB designs, Quant recently used an X-ray setup. With this technology, we can inspect components and circuit boards (PCBs) internally without damaging them. This reveals specific hidden defects that are difficult to detect with the naked eye or conventional test methods.
The X-ray analysis is used, among other things, for:
• Control of solder connections under components such as BGA and QFN
• Detection of air inclusions (voids) and cold soldering
• Detection of internal damage or positioning errors of components
Thanks to this extension, we can analyse PCBs and assemblies even more thoroughly, so that anomalies are identified early and quality increases structurally. The new X-ray setup is a valuable addition to our existing test and inspection methods.
With this investment, Quant strengthens its position as a specialist in high-end PCB design, prototyping and production, and underlines our continuous focus on quality, precision and innovation in electronics development.
